-
![]()
5
-
Modulated pulse power sputtered chromium coatings.pdf
- Modulatedpulse power sputtered chromium coatingsJianliang Lina, John J. Moorea,⁎, William D. Sproula
-
-
![]()
6
-
Deep etching of glass wafers using sputtered molybdenum masks.pdf
- Deep etching of glass wafers using sputtered molybdenum masks
-
-
![]()
10
-
Monte Carlo calculation of the thermalization of atoms sputtered from the cathode of a sputtering discharge.pdf
- The Monte Carlo technique has been used to simulate the thermalization of sputtered atoms in
the filling or background gas within a planar sputtering discharge. The model uses Thompson´s
theoretical distribution of the energy of atoms sputtered from the cathode surface together
with an approximation to the 6-12 Lennard-Jones potential to describe collisions between
sputtered atoms and background gas atoms. The diffusion of the thermalized atoms is included
explicitly in the Monte Carlo calculations. The velocity distribution of sputtered atoms
between the cathode and substrate is calculated, from which their average kinetic energy is
determined as a function of the product Pd, where P is the background gas pressure and d is
the distance from the cathode. Because of the effect of the finite cathode-substrate separation
on back diffusion, it was found that PD, where D is the cathode-to-substrate separation, is an
important parameter in describing thermalization and, consequently
-
-
![]()
6
-
A sputtered nickel under bump metallurgy structure for lead-free solder for use in flip chip packaging.pdf
- The transition to lead free solder requires a change in the under bump metallurgy (UBM) solder wettable layer from copper to nickel due to the lower consumption rate of Ni by high-Sn solders. Nickel deposited by evaporation has high film stress. Nickel deposited by electroless plating using NiP is amorphous, which facilitates rapid atomic diffusion of the solder through the UBM. The failure mechanism in electroless nickel with lead-free SnAgCu solder is similar to that in eutectic SnPb solder. Nickel with 7wt.% vanadium, which is non-magnetic and therefore more easily deposited by magnetron sputtering, has been used successfully with eutectic SnPb solder.
-
-
![]()
12
-
Monte Carlo simulation of the thermalization of sputtered atoms and reflected atoms in the magnetron sputtering discharge.pdf
- The Monte Carlo simulation code ACAT-GAS has been developed in order to simulate the whole
system of a planar magnetron sputtering discharge. The atomic collisions in the cathode, which lead
to sputtering and reflection, are simulated by the ACAT routine of the ACAT-GAS code; the
thermalization of emitted atoms in the background gas within the a planar sputtering discharge is
simulated by the Monte Carlo technique, where the Thomas–Fermi–Morse potential is used to
describe collisions between ejected atoms and background gas atoms. The simulated average energy
of sputtered atoms at the midpoint between the cathode and the substrate is in good agreement with
experimental results. It is found that various physical quantities such as the velocity distributions of
sputtered atoms and reflected atoms, the transmission rate of sputtered atoms and reflected atoms,
the average energies in the background gas, and the normalized energy of arriving reflected atoms
at the substrate depends strongly
-
-
![]()
9
-
Electrical, morphological and structural properties of RF magnetron sputtered Mo thin ?lms for application in thin ?lm photovoltaic solar cells.pdf
- Electrical, morphological and structural properties of RF magnetron sputtered Mo thin films for application in thin film photovoltaic solar cells
-
向豆丁求助：有没有sputtered?
