A sputtered nickel under bump metallurgy structure for lead-free solder for use in flip chip packaging
本文档由 wang5945 分享于2010-03-31 18:37
The transition to lead free solder requires a change in the under bump metallurgy (UBM) solder wettable layer from copper to nickel due to the lower consumption rate of Ni by high-Sn solders. Nickel deposited by evaporation has high film stress. Nickel deposited by electroless plating using NiP is amorphous, which facilitates rapid atomic diffusion of the solder through..
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