Non-Conductive vs. Conductive Via Fill
本文档由 flounce 分享于2010-11-03 13:23
As designers are faced with greater part density, finer pitch array devices and the need to place passive on the backside of PCBs within the array outline, the use of Via-in-Pad designs and filled vias with plated caps has increased dramatically. The primary materials used to fill the plated holes for these applications are silver filled conductive epoxy and non-conductive ..
下载文档
收藏
打印
君,已阅读到文档的结尾了呢~~