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约有32篇,以下是第1-10 排序:相关性|最多阅读|最新上传

12 Pages
thermal analysis of pad-on-disc contact under tribological solicitations a coupled numerical-experimental approach to identify surface temperatures and flow partition coefficient
thermal analysis of pad-on-disc contact under tribological solicitations a coupled numerical-experimental approach to identify surface temperatures and flow partition coefficient...
  • 0
  • 上传人: s7fmk613y 2017-01-12 04:47
  • 热度: 格式: pdf
7 Pages
Conditioning Effect on Pad Surface Height Distribution in Copper CMP
Conditioning Effect on Pad Surface Height Distribution in Copper CMP
  • 0
  • 上传人: sanshengco1 2020-02-22 20:56
  • 热度: 格式: pdf
78 Pages
optimal drainage area and surface pad postioning for sagd development
optimal drainage area and surface pad postioning for sagd development
  • 0
  • 上传人: duanduxi 2016-08-14 02:02
  • 热度: 格式: pdf
4 Pages
Pad Surface Roughness and Slurry Particle Size Distribution Effects on Material Removal Rate in Chemical Mechanical Planarization
Pad Surface Roughness and Slurry Particle Size Distribution Effects on Material Removal Rate in Chemical Mechanical Planarization
  • 0
  • 上传人: sanshengco1
  • 2020-02-22 23:20
  • 热度:
  • 格式: pdf
1篇相似文档
5 Pages
A Study on Pad Surface Characterization and Design for Chemical Mechanical Polishing (CMP)-Fabrication Process and Prototype -
A Study on Pad Surface Characterization and Design for Chemical Mechanical Polishing (CMP)-Fabrication Process and Prototype -
  • 0
  • 上传人: xiaoyunerbohe 2020-02-22 20:17
  • 热度: 格式: pdf
16 Pages
Effect of pad surface roughness on material removal rate :垫表面粗糙度对材料去除率的影响
Effect of pad surface roughness on material removal rate :垫表面粗糙度对材料去除率的影响
  • 0
  • 上传人: 搜搜文档 2014-02-06 09:05
  • 热度: 格式: pdf
3 Pages
Pad Surface Roughness and Cu CMP Performance垫的表面粗糙度和铜CMP的性能
Pad Surface Roughness and Cu CMP Performance垫的表面粗糙度和铜CMP的性能论文 总结 英语 资料 ppt 文档 免费阅读 免费分享,如需请下载!
  • 0
  • 上传人: 复旦文库 2013-12-27 14:29
  • 热度: 格式: pdf
8 Pages
effect of al pad surface morphology on the flip-chip solder:铝垫表面形貌对倒装焊焊接的影响
effect of al pad surface morphology on the flip-chip solder:铝垫表面形貌对倒装焊焊接的影响
  • 0
  • 上传人: songqqlian 2016-05-18 08:14
  • 热度: 格式: pdf
9 Pages
The Characterization of Al Bond Pad Surface Treatment in...
The Characterization of Al Bond Pad Surface Treatment in...
  • 0
  • 上传人: 883997 2016-01-18 18:08
  • 热度: 格式: pdf
6 Pages
Brake Pad Surface Topography Part I Contact Pressure...
Brake Pad Surface Topography Part I Contact Pressure...
  • 0
  • 上传人: vdcjcr51 2016-05-30 03:34
  • 热度: 格式: pdf

向豆丁求助:有没有pad surface?