半导体封装测试概论
本文档由 考研资料 分享于2009-03-31 02:16
晶圆级封装(wafer level CSP) Balls pad open & Solder bumping Wafer level final testing Process Flow Wafer incoming CONFIDENTIAL Process Flow BCB coating Sputter Ti/Cu CONFIDENTIAL Process Flow CONFIDENTIAL PR coating Cu / Ni...
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君，已阅读到文档的结尾了呢~~